eSUN PLA+
eSUN
210–230
°C
Print Temp
55–65
°C
Bed Temp
65
°C
Max Service
Overview
eSUN PLA+ is one of the most popular PLA+ formulations globally. Higher toughness than standard PLA with slightly better heat resistance. Runs at 210-230°C — warmer than standard PLA. Very widely available and affordable.
Properties
Difficulty
beginner
Flexibility
rigid
Layer Adhesion
excellent
Enclosure
no
Heated Bed
recommended
Dry Storage
no
Pros
- Improved toughness over standard PLA, bright colors, great value, widely available
Cons
- Not as strong as PETG, limited heat resistance
Best For
- General printing requiring slightly better toughness than PLA
- prototypes
- functional parts up to 65°C
Avoid For
- Applications needing standard PLA processing temps — runs warmer
Laser Compatibility
LASER INTERACTION
Safety: SAFE — PLA base polymer. Standard ventilation sufficient.
CO2 engrave: 300-400mm/s @ 15-20% | Diode 20W: 3000mm/min @ 35%
Result: Clean dark marks. Good contrast on light colors.
Fumes: Lactic acid derivatives — low hazard.
Note: eSUN PLA+ specific additives are well-characterized — safe to engrave.
Brands
eSUN