eSUN LW-PLA
eSUN
240–260
°C
Print Temp
45–60
°C
Bed Temp
60
°C
Max Service
Overview
eSUN Lightweight PLA — foaming agent causes PLA to expand at high temperatures, creating a foam-like low-density structure. Used for RC aircraft, drones, and weight-sensitive applications. Use 50-75% of normal flow rate.
Properties
Difficulty
advanced
Flexibility
rigid
Layer Adhesion
excellent
Enclosure
no
Heated Bed
recommended
Dry Storage
recommended
Pros
- Low density foam effect, great for RC planes and lightweight structures, huge volume savings
Cons
- Very niche use, can clog at wrong temps, needs tuning
Best For
- RC aircraft fuselages
- drone components
- any weight-critical application where strength-to-weight ratio matters
Laser Compatibility
LASER INTERACTION
Safety: SAFE — PLA base polymer. Standard ventilation sufficient.
CO2 engrave: 300-400mm/s @ 15-20% | Diode 20W: 3000mm/min @ 35%
Result: Clean dark marks. Good contrast on light colors.
Fumes: Lactic acid derivatives — low hazard.
Note: Foam structure has lower density and more air pockets — laser absorbs differently. Settings will vary significantly from solid PLA.
Brands
eSUN